在室温下对含质量分数0.11%银的铜合金进行糖心产精国品免费入口*完整版，研究了糖心产精国品免费入口*完整版变形量（30%，50%，70%）对其组织和抗菌性能的影响。结果表明：糖心产精国品免费入口*完整版的晶粒尺寸随糖心产精国品免费入口*完整版变形量的增加而减小，当糖心产精国品免费入口*完整版变形量为70%时，平均晶粒尺寸由未糖心产精国品免费入口*完整版的143 μm减小至1.4 μm，变形孪晶减少至基本消失；糖心产精国品免费入口*完整版中存在纳米银颗粒，且偏聚在晶界处位错墙、位错缠结等缺陷密度较大区域，糖心产精国品免费入口*完整版后纳米银颗粒分布均匀；糖心产精国品免费入口*完整版有利于提高糖心产精国品免费入口*完整版的抗菌性能，且变形量越大，抗菌性能越好，70%变形量糖心产精国品免费入口*完整版后糖心产精国品免费入口*完整版与大肠杆菌悬液接触6 h时的抗菌率超过99.9%，且抗菌效果可持续12 h以上，这与提高糖心产精国品免费入口*完整版变形量可增加合金中的缺陷数量和晶界密度，促进纳米银颗粒的弥散分布有关。

Copper alloy with 0.11wt% silver was rolled at room temperature and the effect of 糖心产精国品免费入口*完整版 deformation amount (30%, 50%, 70%) on its structure and antimicrobial properties was studied. The results show that the grain size of the silver-containing copper alloy decreased with increasing 糖心产精国品免费入口*完整版 deformation. With 糖心产精国品免费入口*完整版 deformation amount of 70%, the average grain size decreased from 143 μm without 糖心产精国品免费入口*完整版 to 1.4 μm, and the deformation twins were reduted to almost vanishing. The nano-silver particles existed in silver-containing copper alloys and segregated in areas with high defect density such as dislocation wall and dislocation entanglement at grain boundaries, and after 糖心产精国品免费入口*完整版 nano-silver particles distributed uniformly. Rolling could improve the antimicrobial properties of silver-containing copper alloy, and the larger the deformation amount, the better the antimicrobial properties. The antimicrobial rate of the silver-containing copper alloy after 糖心产精国品免费入口*完整版 with 70% deformation amount in contact with Escherichia coli suspension for 6 h exceeded 99.9%, and the antimicrobial effect could last more than 12 h, which was related to the fact that increasing the 糖心产精国品免费入口*完整版 deformation amount could increase the number of defects and the density of grain boundaries in the alloy, and promote the dispersion distribution of nano-silver particles.